Report/Guide

Zou, L; Hunt, C (2013) Guideline for measuring coating adhesion to electronic boards using tape peel testing. Measurement Good Practice Guide. 117

Wickham, M; Hunt, C; Birch, B*; Furlong, J* (2010) Reliability of electronic substrates after processing at lead-free soldering temperatures; Part 2. NPL Report. MAT 38

Wickham, M; Jennett, N M; Nunn, J; Gohil, D D; Hunt, C (2009) Measuring tin whiskering propensity:measuring internal stress in tin coatings by nanoindentation. NPL Report. MAT 29

Wickham, M; Hunt, C (2008) Test method for measurement of the propensity for conformal coatings to inhibit tin whiskering. NPL Report. MAT 28

Di Maio, D; Willis, B; Hunt, C (2008) Measurements of copper dissolution in lead-free solder alloys. NPL Report. MAT 26

Di Maio, D; Hunt, C (2008) Investigation methods of the beta to alpha tin allotropic transformation. NPL Report. MAT 21

Wickham, M; Salter, M; Ridler, N M; Dusek, M; Hunt, C (2008) On-wafer testing of PCB lines as a production assessment method for anisotropic conductive film bonding. NPL Report. MAT 18

Zou, L; Hunt, C (2008) Electrochemical impedance technique to predict circuit reliability with lead-free solders. NPL Report. MAT 15

Wickham, M; Zou, L; Hunt, C (2008) Test method for recyclable electronic substrates utilising additive technology. NPL Report. MAT 16

Wickham, M; Dusek, M; Hunt, C (2007) Reliability of electronic substrates after processing at lead-free soldering temperatures. NPL Report. MAT 10

Wickham, M; Zou, L; Hunt, C (2007) Preliminary measurements for thermoplastic electronics: developing a stress screening test. NPL Report. MAT 6

Di Maio, D; Hunt, C (2007) High-frequency vibration tests of Sn-Pb and lead-free solder joints. NPL Report. MAT 2

Wickham, M; Hunt, C (2007) XRF measurement of residual materials in electronics. NPL Report. MAT 4

Wickham, M; Hunt, C (2007) Relative reliability measurements for electrically conductive adhesive joints on subtractive thermoplastic substrates. NPL Report. MN 2

Zou, L; Hunt, C (2007) Susceptibility of lead-free systems to electrochemical migration. NPL Report. MAT 1

Zou, L; Hunt, C (2007) Test method for conformal coating protection performance of electronic assembly in harsh environments. NPL Report. DEPC-MPR 060

Zou, L; Hunt, C (2006) Protection performance of conformal coatings in harsh environments. NPL Report. DEPC-MPR 054

Zou, L; Hunt, C (2005) Solderability testing with components preheating. NPL Report. DEPC-MN 038

Wickham, M; Zou, L; Dusek, M; Hunt, C (2005) Measuring the impact of component solderability on lead-free solder joint reliability. NPL Report. DEPC-MPR 038

Dusek, M; Hunt, C (2005) The analytical model II for predicting solder joint shape and volume impact on life-time. NPL Report. DEPC-MPR 039

Zou, L; Hunt, C (2005) Development of preheat on solderability testing. NPL Report. DEPC-MPR 036

Dusek, M; Wickham, M; Hunt, C (2005) Effect of PCB finish, processing and microstructure on lead-free solder joint reliability. NPL Report. DEPC-MPR 028

Mensah, A; Hunt, C (2005) The role of permeability and ion transport in conformal coating protection. NPL Report. DEPC-MPR 032

Wickham, M; Zou, L; Hunt, C (2005) Measuring the effect on isotropic electrically conductive adhesive reliability of substrate and component finishes. NPL Report. DEPC-MPR 031

Wickham, M; Zou, L; Dusek, M; Hunt, C (2005) Measuring the reliability of electronics assemblies during the transition period to lead-free soldering. NPL Report. DEPC-MPR 030

Brewin, A; Zou, L; Dusek, M; Hunt, C (2005) Preliminary measurements of soldering flux residues in AC environment. NPL Report. DEPC-MPR 029

Dusek, M; Hunt, C (2005) Creep rates and stress relaxation for micro-sized lead-free solder joints. NPL Report. DEPC-MN 021

Wickham, M; Dusek, M; Zou, L; Hunt, C (2005) Effect of voiding on lead-free reliability. NPL Report. DEPC-MPR 033

Dusek, M; Hunt, C (2005) The measurement of creep rates and stress relaxation for micro sized lead-free solder joints. NPL Report. DEPC-MPR 021

Wickman, M; Fry, A T; Gohil, D D; Hunt, C (2005) Developing a test method to characterise internal stress in tin coatings: phase 2. NPL Report. DEPC-MPR 014

Zou, L; Brewin, A; Hunt, C (2004) Guidelines for measuring anionic contamination of Printer Circuit Boards (PCB) and Circuit Assemblies (PCA) using ion chromatography. Measurement Good Practice Guide. 76

Wickham, M; Zou, L; Hunt, C (2004) Developing a stress screening regime for isotropic electrically conductive adhesives. NPL Report. DEPC-MPR 005

Dusek, M; Hunt, C (2004) Measurement note - crack detection methods for lead-free solder joints. NPL Report. DEPC-MN 001

Dusek, M; Hunt, C (2004) Crack detection methods for lead-free solder joints. NPL Report. MATC(A)164

Dusek, M; Wickham, M; Hunt, C (2004) Shear strength of lead-free solder joints. NPL Report. MATC(MN)57

Dusek, M; Hunt, C (2004) The analytical model for thermal cycling. NPL Report. MATC(A)163

Zou, L; Lea, D; Hunt, C (2004) Solderability testing of surface mount components and PCB pads. Measurement Good Practice Guide. 66

Brewin, A; Zou, L; Hunt, C (2004) Susceptibility of glass-reinforced epoxy laminate to conductive anodic filamentation. NPL Report. MATC(A)155

Le Toux, T; Dusek, M; Hunt, C (2003) The effect of temperature on microstructure of lead-free solder joints. NPL Report. MATC(A)157

Dusek, M; Wickham, M; Hunt, C (2003) The impact of thermal cycle regime on the shear strength of lead-free solder joints. NPL Report. MATC(A)156

Wickham, M; Fry, A T; Hunt, C (2003) Developing a test to characterise internal stress in tin coatings: phase 1. NPL Report. MATC(A)148

Wickman, M; Brewin, A; Zou, L; Hunt, C (2003) Code of practice for the electronic components and PCBs in lead-free processing. NPL Report. MATC(A)141

Wickham, M; Zou, L; Dusek, M; Hunt, C (2002) Design guidelines for ultra fine pitch solder paste printing. NPL Report. MATC(A)127

Brewin, A; Zou, L; Hunt, C (2002) Development of new solderability test fluxes. NPL Report. MATC(A)122

Brewin, A; Zou, L; Hunt, C (2002) Test procedure for process validation with surface insulation resistance. NPL Report. MATC(A)121

Dusek, M; Hunt, C (2002) A test procedure for measurement of solder volume effect on reliability. NPL Report. MATC(A)128

Dusek, M; Hunt, C (2002) A test procedure for measuring print quality. NPL Report. MATC(A)129

Wickham, M; Hunt, C (2002) A comparison of automatic optical inspection systems for use with lead-free surface mount assemblies. NPL Report. MATC(A)119

Zou, L; Dusek, M; Wickham, M; Hunt, C (2002) Characterising stencil printing of surface mount and conductive adhesives. NPL Report. MATC(A)55

Dusek, M; Zou, L; Hunt, C (2002) Rheology testing of solder pastes and conductive adhesives - a guide. NPL Report. MATC(A)109

Hunt, C; Nottay, J; Brewin, A; Dinsdale, A T (2002) Predicting microstructure of mixed solder alloy systems. NPL Report. MATC(A)83

Brewin, A; Hunt, C; Dusek, M; Nottay, J (2002) Reliability of joints formed with mixed alloy solders. NPL Report. MATC(A)85

Wickham, M; Brewin, A; Hunt, C (2002) Rework of mixed lead-free alloys - a guide. NPL Report. MATC(A)106

Dusek, M; Zou, L; Hunt, C (2002) Rheology testing of solder pastes and conductive adhesives used in stencil printing. NPL Report. MATC(A)102

Dusek, M; Hunt, C (2002) Test methods for evaluating the reliability of PCB finishes using lead-free alloys - a guide. NPL Report. MATC(A)107

Wickham, M; Zou, L; Hunt, C (2002) An assessment of the suitability of current PCB laminates to withstand lead-free reflow profiles. NPL Report. MATC(A)91

Wickham, M; Zou, L; Dusek, M; Hunt, C (2002) A review of electronics materials deposition techniques including solder jetting and relief printing. NPL Report. MATC(A)92

Brewin, A; Zou, L; Hunt, C (2002) Test method for dispensing electronic process materials. NPL Report. MATC(A)86

Dusek, M; Hunt, C (2002) Assessment of rheological properties of materials used in printing of solder paste. NPL Report. MATC(A)76

Brewin, A; Zou, L; Hunt, C (2001) Code of practice for dispensing electronic materials. NPL Report. MATC(A)82

Brewin, A; Zou, L; Hunt, C (2001) Stability of electronic components in lead-free processing. NPL Report. MATC(A)79

Zou, L; Dusek, M; Wickham, M; Hunt, C (2001) The effect of solder alloy, metal particle size and substrate resist on fine pitch stencil printing performance. NPL Report. MATC(A)18

Hunt, C (2001) Development of surface insulation resistance measurements for electronic assemblies. NPL Report. MATC(A)70

Nottay, J; Dusek, M; Wickham, M; Hunt, C (2001) Reworking solder alloy mixtures of lead-free and tin-lead alloys. NPL Report. MATC(A)73

Dusek, M; Nottay, J; Hunt, C; Lu, H*; Bailey, C* (2001) An experimental validation of modelling for Pb-free solder joint reliability. NPL Report. MATC(A)11

Dusek, M; Hunt, C (2001) A novel measurement technique for stencil printed solder paste. NPL Report. MATC(A)08

Wickham, M; Nottay, J; Hunt, C (2001) A review of mechanical test method standards for lead-free solders. NPL Report. MATC(A)69

Lea, D; Dusek, M; Jonck, F; Hunt, C (2001) Solderability of electrical components and copper using lead-free alloys. NPL Report. CMMT(A)284

Dusek, M; Nottay, J; Hunt, C (2001) Compatibility of lead-free solders with PCB materials. NPL Report. MATC(A)89

Nottay, J; Dusek, M; Hunt, C; Bailey, C*; Lu, H* (2001) Creep properties of SnAgCu solder in surface mount assemblies. NPL Report. MATC(A)51

Zou, L; Dusek, M; Wickham, M; Hunt, C (2001) Fine pitch stencil printing using enclosed printing systems. NPL Report. MATC(A)09

Wickham, M; Lea, D; Nottay, J; Hunt, C (2001) Processability of lead-free component termination materials. NPL Report. MATC(A)47

Zou, L; Dusek, M; Wickham, M; Hunt, C (2001) The effect of metal content and flux chemistry on fine pitch stencil printing performance using an enclosed print head. NPL Report. MATC(A)10

Lea, D; Jonak, F; Hunt, C (2001) Solderability measurements of PCB pad finishes and geometries. NPL Report. MATC(A)3

Brewin, A; Hunt, C (2001) Test method for the measurement of tensile and shear tack for electronic solder pastes and adhesives. NPL Report. MATC(A)31

Brewin, A; Zou, L; Hunt, C (2001) Tack of electronic adhesives in tension and shear. NPL Report. MATC(A)30

Hunt, C (2001) Technology mission to assess the status of lead-free soldering in Japan. NPL Report. MATC(A)12

Brewin, A; Zou, L; Hunt, C (2001) Tack testing of solder paste in tension and shear. NPL Report. MATC(A)29

Zou, L; Hunt, C (2000) Validation of a new surface insulation resistance (SIR) test method. NPL Report. CMMT(A)300

Dusek, M; Hunt, C (2000) Best practice guide for thermocycling and reliability assessment of solder joints. NPL Report. CMMT(A)274

Dusek, M; Nottay, J; Hunt, C (2000) A test methodology for assessing Pb-free solder joint reliability. NPL Report. CMMT(A)273

Dusek, M; Nottay, J; Hunt, C (2000) The use of shear testing and thermal cycling for assessment of solder joint reliability. NPL Report. CMMT(A)268

Wickham, M; Dusek, M; Hunt, C (2000) Fine pitch paste stencil printing using enclosed printing heads. NPL Report. CMMT(A)247

Hunt, C; Zou, L (1999) Development of a new surface insulation resistance (SIR) test method. NPL Report. CMMT(A)235

Zou, L; Hunt, C (1999) The effect of test voltage, test pattern and board finish on surface insulation resistance (SIR) measurements for various fluxes. NPL Report. CMMT(A)222

Dusek, M; Hunt, C (1999) The impact of solderability on reliability and yield of surface mount assembly. NPL Report. CMMT(A)214

Green, S; Hunt, C (1999) Influence of rework conditions on microstructure in tin-lead solder joints. NPL Report. CMMT(A)216

Dusek,M,; Hunt, C (1999) Optimum pad design and solder joint shape for reliability. NPL Report. CMMT(A)215

Green, S; Lea, D; Hunt, C (1999) Solderability measurements with lead-free alloys. NPL Report. CMMT(A)213

Wickham, M; Hunt, C (1999) A comparison of automatic optical inspection and automatic x-ray inspection of surface mount assemblies. NPL Report. CMMT(A) 234

Wickham, M; Hunt, C (1999) Benchmarking assisted and automatic optical inspection of electronic assemblies. NPL Report. CMMT(A)173

Zou, L; Hunt, C (1999) Draft NPL SIR measurement procedure. NPL Report. CMMT(A)155

Richards, B; Levoguer, C L; Hunt, C; Nimmo, K*; Peters, S*; Cusack, P* (1999) An analysis of the current status of lead-free soldering. A summary report. NPL Report. CMMT(A)168

Richards, B; Levoguer, C L; Hunt, C; Nimmo, K*; Peters, S*; Cusack, P* (1999) An analysis of the current status of lead-free soldering. NPL Report. CMMT(A)170

Hunt, C; White, D; Dusek, M; Wickham, M (1998) Impact on assembly yields when substituting palladium finished for Tin/Lead finished components. NPL Report. CMMT(A)130

Hunt, C (1998) Measuring stencil printed solder paste. NPL Report. CMMT(A)127

Hunt, C; Zou, L (1998) Instructions for an intercomparison of the surface insulation resistance (SIR) technique. NPL Report. CMMT(A)122

Zou, L; Hunt, C (1998) Surface insulation resistance (SIR) response to various processing parameters. NPL Report. CMMT(A)120

Hunt, C; Zou, L (1998) The impact of temperature and humidity conditions on surface insulation resistance (SIR) values for various fluxes. NPL Report. CMMT(A)119

Hunt, C (1998) Survey of sensor requirements for environmental exposure of electronic assemblies. NPL Report. CMMT(A)115

Zou, L; Dusek, M; Hunt, C (1998) Evaluate the effect of ageing on the cleanabilty of solder flux residues. NPL Report. CMMT(A)107

Wickham, M*; Hunt, C (1998) Survey of rework practices in the UK electronics assembly industry. NPL Report. CMMT(A)91

Burton, P*; Footner, P*; Prichard, D*; Richards, B*; Hunt, C (1996) Surface insulation resistance measurements: A review of the various SIR parameters. NPL Report. CMMT(A)48

Hunt, C (1996) The influence of solderability on reliability in Electronic Assemblies. NPL Report. CMMT(A)47

Hitchens, L*; Wickham, M*; Hunt, C (1996) Ageing properties of organic solderable preservatives. NPL Report. CMMT(A)41

Article

Iakovlev, D; Hu, S; Hassan, H; Dwyer, V; Ashayer-Soltani, R; Hunt, C; Shen, J (2018) Smart Garment Fabrics to Enable Non-Contact Opto-Physiological Monitoring. Biosensors, 8 (2). 33 ISSN 2079-6374

Wills, K A; Krzyzak, K; Bush, J; Ashayer-Soltani, R; Graves, J E; Hunt, C; Cobley, A J (2018) Additive process for patterned metallized conductive tracks on cotton with applications in smart textiles. The Journal of The Textile Institute, 109 (2). pp. 268-277. ISSN 0040-5000

Lewis, A P; Hunt, C; Thomas, O; Wickham, M (2017) High-Speed Non-Contact Sheet Resistivity Monitoring of Printed Electronics using Inductive Sensors. Flexible and Printed Electronics, 2 (4). 044001

Gopee, V; Thomas, O; Hunt, C; Stolojan, V*; Allam, J*; Silva, S R P* (2016) Carbon nanotube interconnects realized through functionalization and sintered silver attachment. ACS Appl. Mater. Interfaces, 8 (8). pp. 5563-5570.

Ashayer-Soltani, R; Hunt, C; Thomas, O (2016) Fabrication of highly conductive stretchable textile with silver nanoparticles. Tex. Res. J., 86 (10). pp. 1041-1049.

Samano, A*; Xu, Y*; Harrison, D*; Hunt, C; Wickham, M; Thomas, O (2016) Impedance and resistance of carbon ink during cure. Circuit World, 42 (3). pp. 117-126.

Zou, L C; Hunt, C (2015) A new approach to investigate conductive anodic filament (CAF) formation. Solder. Surf. Mount Technol., 27 (1). pp. 22-30.

Thomas, O; Wickham, M; Hunt, C (2012) Obtaining the moisture content of printed circuit boards from capacitance measurements. Circuit World, 38 (2). pp. 68-74.

Zou, L; Hunt, C (2012) A new conformal coating adhesion test for electronic assemblies. Solder. Surf. Mount Technol., 24 (1). pp. 12-21.

Di Maio, D; Hunt, C (2011) On the absence of the beta to alpha Sn allotropic transformation in solder joints made from paste and metal powder. Microelectron. Eng., 88 (1). pp. 117-120.

Di Maio, D; Hunt, C (2010) Time-Lapse photography of the beta-Sn/alpha-Sn allotropic transformation. J. Mater. Sci., Mater. Electron., 20 (4). pp. 386-391.

Kamara, E*; Lu, H*; Hunt, C; Di Maio, D; Thomas, O (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectron. Reliability, 50 (9-11). pp. 1706-1710.

Zou, L; Hunt, C (2009) Characterisation of the conduction mechanisms in adsorbed electrolyte layers on electronic boards using AC impedance. J. Electrochem. Soc., 156 (1). C8-C45

Di Maio, D; Hunt, C (2009) Monitoring the growth of the a phase in tin alloys by electrical resistance measurements. J. Electorn. Mater., 38 (9). pp. 1874-1880.

Di Maio, D; Hunt, C (2009) Time-Lapse photography of the beta-Sn/alpha-Sn allotropic transformation. J. Mater. Sci., Mater. Electron., 20 (4). pp. 386-391.

Zou, L; Hunt, C (2008) Electrochemical behaviour of metal interconnects in electronic assemblies. J. Mater. Res., 23 (10). pp. 2622-2629.

Hunt, C (2007) Susceptibility of glass-reinforced epoxy laminates to conductive anodic filamentation. CircuiTree, 20 (3). pp. 30-35.

Hunt, C; Lea, D; Adams, S M*; Stratton, P F* (2002) Inert research for lead-free soldering. Electron. Manuf. Test (Aug). pp. 9-10.

Hunt, C; Zou, L (1999) The impact of temperature and humidity conditions on surface insulation resistance (SIR) values for various fluxes. Journal of Soldering and Surface Mount Technology, 11 (1). pp. 36-43.

Hunt, C (1997) Measuring and predicting solderability. Future Circuits.

Seah, M P; Hunt, C (1993) Calibration of the binding energy scale of an X-ray photoelectron spectrometer. UKESCA Users Group Newsletter, 15. pp. 6-10.

Conference or Workshop Item

Samano, A*; Xu, Y*; Harrison, D*; Hunt, C; Wickham, M; Thomas, O (2014) Third harmonic measurement in printed electronics. In: 3rd Asia-Pacific Conference on Antennas and Propagation., 26-29 July 2014, Harbin, China.

Kamara, E*; Lu, H*; Bailey, C*; Thomas, O; Di Maio, D; Hunt, C; Fulton, I (2012) Inverse analysis of solder joint creep properties. In: 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 13-16 August 2012, Guilin, China.

Kamara, E*; Hua Lu*,; Bailey, C*; Hunt, C; Di Maio, D; Thomas, O (2010) Computer simulation and design of a solder joint vibration test machine. In: 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 26-28 April 2010, Bordeaux, France.

Shishido, N*; Kanno, T*; Kawahara, S*; Ikeda, T*; Miyazaka, N*; Lu, H*; Bailey, C*; Thomas, O; Di Maio, D; Hunt, C (2010) An analysis of local deformation of SnAgCu solder joint using digital image correlation. In: 2010 11th International Conference on Electronic Pakaging Techology and High Density Packaging., 16-19 August 2010, Xi'an.

Di Maio, D; Murdoch, C*; Thomas, O; Hunt, C (2010) The degradation of solder joints under high current density and low-cycle fatigue. In: 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 26-28 April 2010, Bordeaux, France.

Hunt, C; Di Maio, D (2009) A test methodology for copper dissolution in lead-free alloys. In: Annual IPC International Conference for Electronic Board Design and Manufacture, and assembly (IPC APEX 2009)., 31 March - 2 April 2009, Las Vegas, USA.

Dusek, M; Hunt, C (2008) Fatigue damage prediction during thermo-mechanical cycling for lead-free solders. In: ESTC 2008: 2nd Electronics System-integration Technology Conference Proceedings, 2008.

Ridout, S*; Dusek, M; Bailey, C*; Hunt, C (2005) Modeling and experiments on an isothermal fatigue test for solder joints. In: Thermal Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 18-20 April 2005, Berlin, Germany.

Adams, S M*; Hunt, C; Lea, D (2002) Wetting balance evaluations of the solderability of lead-free solders. In: European Microelectronics Packaging and Interconnection Symposium. IMAPS Europe, 16-18 June 2002, Cracow, Poland.

Lu, H*; Bailey, C*; Dusek, M; Hunt, C; Nottay, J (2000) Modelling the fatigue life of solder joints for surface mount resistors. In: International Symposium on Electronic Materials and Packaging, 30 November - 3 December 2000, Hong Kong.

Hunt, C (1999) Palladium finished components and the impact on defect levels. In: 12th European Microelectronics and Packaging Conference Proceedings, 7-9 June 1999, Harrogate, UK.