Brewin, A; Zou, L; Hunt, C (2002) Test method for dispensing electronic process materials. NPL Report. MATC(A)86

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Abstract

Robotic dispensing provides flexibility for electronics production not possible from screen-printing processes. As well as the application of solder paste and surface mount adhesives, dispensing systems are utilised with newer technologies such as the application of conductive adhesives, chip on board, glob-tops and flip chip underfills.
This document describes test methods for characterising the behaviour of these material types, which should help in optimising the dispensing process and in improving dispensing results.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	MATC(A)86
Keywords:	dispensing, solder paste, adhesive conductive adhesives, chip on board glob-tops, flip-chip underfills
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:17
URI:	http://eprintspublications.npl.co.uk/id/eprint/2334

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