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Stability of electronic components in lead-free processing.

Brewin, A; Zou, L; Hunt, C (2001) Stability of electronic components in lead-free processing. NPL Report. MATC(A)79

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With the widening interest and need to implement a lead-free process there has been much discussion and speculation on the stability of electronic components. In this study a range of components were selected and their functional and physical stability during lead-free reflow conditions assessed. The surface mount components examined were various LEDs, polyester and electrolytic capacitors, crystal oscillators, polyamide connectors and BGAs.
The work has shown that only minor effects occur, with the majority of components remaining within specification. There are, however, concerns with capacitors.
Industry concerns about lead-free soldering with these component types are addressed in light of the results.

Item Type: Report/Guide (NPL Report)
NPL Report No.: MATC(A)79
Keywords: lead-free, reflow, profiling, LED, capacitors, crystal oscillators, BGA
Subjects: Advanced Materials
Advanced Materials > Electronics Interconnection
Last Modified: 02 Feb 2018 13:17
URI: http://eprintspublications.npl.co.uk/id/eprint/2204

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