Dusek, M; Zou, L; Hunt, C (2002) Rheology testing of solder pastes and conductive adhesives used in stencil printing. NPL Report. MATC(A)102

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Abstract

A novel method using video sequences to indirectly measure shear strain rate, during the printing process, is utilised to measure the viscosity of paste extracts and conductive adhesives at predetermined shear strain rates. Oscillatory tests were conducted to assess the linear visco-elastic region of solder paste, to characterise material responses at various frequencies. A better understanding of the rheological properties and the ideal parameter values will lead to the widening of the process window during stencil printing. Optimising the rheological properties and maintaining these over a wide range of operational conditions will be key to designing new printing media. The rheology of printing materials are complex and as illustrated in this report are not amenable to single viscosity measurements of the complete media. Hence, simple measurements by the user on media are unlikely to provide valuable information. Full characterisation may be possible but would be only cost effective to a few.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	MATC(A)102
Keywords:	solder paste, rheology, shear rate, visco-elastic
Subjects:	Advanced Materials Advanced Materials > Polymer Rheology
Last Modified:	02 Feb 2018 13:17
URI:	http://eprintspublications.npl.co.uk/id/eprint/2394

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