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Rheology testing of solder pastes and conductive adhesives - a guide.

Dusek, M; Zou, L; Hunt, C (2002) Rheology testing of solder pastes and conductive adhesives - a guide. NPL Report. MATC(A)109

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Abstract

This guide discusses rheology practice for measuring solder paste and conductive adhesives. The main parameter, viscosity, can be measured to assess the flow properties of printing media. Additional tests can be conducted to assess the viscoeleastic properties of printing media as a response to an oscillating shear stress at various frequencies. The rheology of printing materials is a complex science and as illustrated in this report cannot be simplified to a single static viscosity reading.

Item Type: Report/Guide (NPL Report)
NPL Report No.: MATC(A)109
Keywords: solder paste, rheology, shear rate, visco-elastic
Subjects: Advanced Materials
Advanced Materials > Polymer Rheology
Last Modified: 02 Feb 2018 13:17
URI: http://eprintspublications.npl.co.uk/id/eprint/2393

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