Dusek, M; Hunt, C (2002) Test methods for evaluating the reliability of PCB finishes using lead-free alloys - a guide. NPL Report. MATC(A)107

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Abstract

This guide recommends and details best practice for short-term accelerated thermal cycling as a method of assessing the compatibility (and hence joint reliability) of lead-free solders with the materials of the PCB assembly. The assessment involves electrical continuity and shear test measurements complemented with microstructural observations. Data for various PCB materials assessed using the test method described are reported in MATC(A)89 ' Compatibility of lead-free solders with PCB materials'.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	MATC(A)107
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:17
URI:	http://eprintspublications.npl.co.uk/id/eprint/2338

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