Wickham, M; Hunt, C (2007) Relative reliability measurements for electrically conductive adhesive joints on subtractive thermoplastic substrates. NPL Report. MN 2

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Abstract

This Note describes a new combinational test method for the measurement of relative reliability of electrically conductive adhesive joints on subtractive thermoplastic substrates. These substrates are proposed as an alternative to conventional glass reinforced epoxy substrates to improve the degree of recycling possible in electronics assemblies. They have the advantage of being suitable for fabrication using existing PCB manufacturing infrastructure. The combination of thermal cycling followed by damp heat conditioning has been found to develop high resistance failures in conductive adhesive joints significantly earlier than either damp heat testing or thermal cycling alone. The combination in this order also develops earlier failures than damp heat testing followed by thermal cycling. The test method described allows rapid relative reliability testing of comparable electrically conductive isotropic adhesives to determine the best material for use in a lead-free assembly with high recycling levels.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	MN 2
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:15
URI:	http://eprintspublications.npl.co.uk/id/eprint/3956

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