Dusek, M; Wickham, M; Hunt, C (2004) Shear strength of lead-free solder joints. NPL Report. MATC(MN)57

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Item Type:	Report/Guide (NPL Report)
NPL Report No.:	MATC(MN)57
Keywords:	thermal cycling
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:16
URI:	http://eprintspublications.npl.co.uk/id/eprint/3124

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