Hunt, C (2001) Technology mission to assess the status of lead-free soldering in Japan. NPL Report. MATC(A)12

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Abstract

NPL formed a key part of a mission to Japan to assess lead-free soldering technology organised by DTI International Promoters, and prompted by the SMART Group. The mission found a number of key issues. The initial driver for lead-free was the proposed EU WEEE directive in 1998, but today important drivers are company's own environmental targets and competition between these companies. Interestingly the solder alloy choice of the future will be a SnAgCu alloy, with SnZnBi forming an interesting transitional solution to material and component heat durability issues. In Japan soldering equipment is being modified to minimise the temperature range at the soldering temperature. The necessary technology know-how may put a large strain on SMEs not in an OEM supply chain.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	MATC(A)12
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:17
URI:	http://eprintspublications.npl.co.uk/id/eprint/1880

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