Wickham, M; Lea, D; Nottay, J; Hunt, C (2001) Processability of lead-free component termination materials. NPL Report. MATC(A)47

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Abstract

The performance of four types of lead-free finished has been evaluated and compared to a Palladium Gold (PdAu) alternative. The four types, tin (Sn), tin-silver (SnAg), tin-copper (SnCu) and tin-bismuth (SnBi) were assessed for plating ductility, solderability, moisture ingression, process yield and tin whisker propensity. The PdAu finish was also assessed for wirebondability.
All the finished gave acceptable performance for solderability, process yield, moisture ingression and plating ductility. The PdAu also exhibited acceptable wire bond pull strengths. None of the finished showed whiskering under hot damp conditioning. There were two exceptions, one was a Sn finish plated using a redundant Sn chemistry, and the other was a SnCu finish. Even in these two examples, no whiskers were located on components but only on lead frame salvage, where the components has been cropped in the final operation during their manufacture.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	MATC(A)47
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:17
URI:	http://eprintspublications.npl.co.uk/id/eprint/2036

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