Wickham, M; Nottay, J; Hunt, C (2001) A review of mechanical test method standards for lead-free solders. NPL Report. MATC(A)69

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Abstract

Reviews have been undertaken of mechanical test standards appropriate for electronic solders, and of the credibility of available materials properties of lead-free solders. No test methods specific to solders were located. Moreover, the test methods identified were applicable to bulk samples, not small solder joints. Further, they were conducted under conditions of tension or compression, but not under shear as would be the case in actual solder joints. The review also highlighted the difficulty of comparing mechanical properties data quoted in literature. This difficulty stems from the lack of information given on test methods used, and on the experimental conditions employed (strain rates, sample size, sample geometry, test temperatures etc.). A number of alternative mechanical test methods have been identified. It is recommended that material property data acquired using these alternative test methods should be benchmarked against those from standard thermal cycling tests. Such a benchmarking would provide the industry with a definitive test method with the twin advantages of being directly applicable to small joints and of enabling credible materials properties data to be generated for lead-free solders.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	MATC(A)69
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:17
URI:	http://eprintspublications.npl.co.uk/id/eprint/2123

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