Ridout, S*; Dusek, M; Bailey, C*; Hunt, C (2005) Modeling and experiments on an isothermal fatigue test for solder joints. In: Thermal Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 18-20 April 2005, Berlin, Germany.

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Item Type:	Conference or Workshop Item (UNSPECIFIED)
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:16
URI:	http://eprintspublications.npl.co.uk/id/eprint/3306

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