Zou, L; Hunt, C (2008) Electrochemical behaviour of metal interconnects in electronic assemblies. J. Mater. Res., 23 (10). pp. 2622-2629.

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Abstract

The electrochemical and corrosion behaviours of solder alloys, SnAgCu (SAC), SnZnBi, SnPb, and Sn, and PCB finish materials Cu and AuNi has been investigated in carboxylic acids (flux) and NaCl solutions using the potentiodynamic scanning technique. The work has shown that SAC and Sn are passivated in the diluted flux solution, but SnPb, SnZnBi, Cu and AuNi are under active dissolution when anodically polarised. However, passivation of SAC alloy is not observed in concentrated flux solution. Although a passive film forms on SAC in a 2% NaCl solution, the film is less stable than in the flux solution.

In addition, oxidation of most commonly used lead¿free and lead solders, SAC and SnPb, at high temperature has been evaluated via Sequential Electrochemical Reduction Analysis (SERA). The SERA results revealed that the SAC alloy oxidised more significantly than that on SnPb in a hot dry condition.

Item Type:	Article
Keywords:	Corrosion, soldering, Sn, passivation
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:15
URI:	http://eprintspublications.npl.co.uk/id/eprint/4278

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