Nottay, J; Dusek, M; Hunt, C; Bailey, C*; Lu, H* (2001) Creep properties of SnAgCu solder in surface mount assemblies. NPL Report. MATC(A)51

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Abstract

The move to lead-free solders has highlighted the need for materials property data relating to these new solders. Such data are required to model joint performance and to predict service life under long-term thermo-mechanical fatigue. In consequence, some creep property data of arguably the most attractive lead-free solder, SnAgCu, have been determined in this work using samples and solder joints whose geometrics and sizes were represented of today's surface mount technology. These data were compared to those from the literature on bulk specimens (specifically for SnPb and SnAg solders) using a constitutive model developed by Darveaux. The comparison not only suggested there might be significant differences between the creep properties of the alloys, but also highlighted the importance of joint area and geometry in the determination of the creep behaviour of the solders.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	MATC(A)51
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:17
URI:	http://eprintspublications.npl.co.uk/id/eprint/2121

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