Wickham, M; Zou, L; Hunt, C (2007) Preliminary measurements for thermoplastic electronics: developing a stress screening test. NPL Report. MAT 6

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Abstract

Following the implementation of WEEE legislation, there is an increasing interest in adopting more sustainable manufacturing processes and materials, while maintaing performance. These material and structural changes to the assemblies can lead to alternative failure modes. This work studies the performance of specific favoured materials to qualify the failure mechanisms and the effective stress screening regimes, and hence put in place the underpinning work for developing a test method for characterising these materials.
Thermoplastic printed circuit assemblies based on polyetherimide, were assembled using electrically conductive adhesives and tested using damp heat, dry heat and thermal cycling, and combinations of these. Three generic interconnect styles were investigated.
For the majority of conductive adhesive/component combinations, the combination of thermal cycling followed by damp heat conditioning was found to develop the most damage, and is typical of industrial environments. Where degradation was observed conductive adhesive joints developed high resistance failures earlier than either with damp heat testing or thermal cycling alone, and there was a drop in the shear strength of the joint. Further work will look at developing the detection of failing electrical resistance.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	MAT 6
Keywords:	conductive adhesive, thermoplastic substrate, environment testing
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:15
URI:	http://eprintspublications.npl.co.uk/id/eprint/4047

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