Zou, L; Dusek, M; Wickham, M; Hunt, C (2002) Characterising stencil printing of surface mount and conductive adhesives. NPL Report. MATC(A)55

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Abstract

The increasing need for high-speed deposition of surface mount (SM) and conductive adhesive has generated an interest in stencil printing these materials as an alternative to the traditional dispensing method. The fine pitch printing performance of isotropic conductive adhesives (ICA), and the dot printing of surface mount adhesives (SMA) using both enclosed print head and metal squeegees are investigated here. This study evaluated a number of key aspects of printing with these materials whose material properties are significantly different of solder pastes. Stencil printing parameters were investigated and characterised. The benefit of using enclosed print heads was evaluated and found to be helpful when solvent loss was an issue. Different stencils were assessed for both fine pitch printing and thick stencils for printing typical SMA dot deposits.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	MATC(A)55
Keywords:	stencil printing, conductive adhesives, fine pitch
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:17
URI:	http://eprintspublications.npl.co.uk/id/eprint/2385

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