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The influence of solderability on reliability in Electronic Assemblies.

Hunt, C (1996) The influence of solderability on reliability in Electronic Assemblies. NPL Report. CMMT(A)47

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Item Type: Report/Guide (NPL Report)
NPL Report No.: CMMT(A)47
Subjects: Advanced Materials
Advanced Materials > Electronics Interconnection
Last Modified: 02 Feb 2018 13:18
URI: http://eprintspublications.npl.co.uk/id/eprint/572

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