Dusek, M; Hunt, C (2000) Best practice guide for thermocycling and reliability assessment of solder joints. NPL Report. CMMT(A)274

Text cmmt274.pdf Download (510kB)

Abstract

This guide recommends best practice used for short-term accelerated thermal cycling as a method for assessing solder joint reliability. These techniques (shear testing, and electrical continuity measurements, complemented with microstructural investigations) are described.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	CMMT(A)274
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:17
URI:	http://eprintspublications.npl.co.uk/id/eprint/1592

Actions (login required)

View Item