Dusek, M; Nottay, J; Hunt, C (2000) The use of shear testing and thermal cycling for assessment of solder joint reliability. NPL Report. CMMT(A)268

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Item Type:	Report/Guide (NPL Report)
NPL Report No.:	CMMT(A)268
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:17
URI:	http://eprintspublications.npl.co.uk/id/eprint/1606

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