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The use of shear testing and thermal cycling for assessment of solder joint reliability.

Dusek, M; Nottay, J; Hunt, C (2000) The use of shear testing and thermal cycling for assessment of solder joint reliability. NPL Report. CMMT(A)268

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Item Type: Report/Guide (NPL Report)
NPL Report No.: CMMT(A)268
Subjects: Advanced Materials
Advanced Materials > Electronics Interconnection
Last Modified: 02 Feb 2018 13:17
URI: http://eprintspublications.npl.co.uk/id/eprint/1606

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