Hunt, C; Nottay, J; Brewin, A; Dinsdale, A T (2002) Predicting microstructure of mixed solder alloy systems. NPL Report. MATC(A)83

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Abstract

In the transition to lead-free soldering the potential for creating joints soldered with alloys of mixed and unknown composition will increase (e.g. through rework, repair, component finishes), raising questions on joint reliability. In this work the ability of a modelling tool, MTDATA, to predict the phases in the solder joints in such circumstances has been studied as a possible method in aiding rapid reliability assessment. Three experimental techniques (microstructure formed within the joints fabricated from various mixtures of SnPb and SnAgCu alloys. The results were compared directly with those on phase composition, enthalpy and heat capacity predicted from the MTDATA modelling. The encouraging agreement between the experimental data and the modelled predictions, demonstrates that the MTDATA tool may have a potentially key role in predicting alloy performance, especially in the transition period towards lead-free soldering, and should be further investigated. The whole approach can yield benefits in studying the effect of alloy mixtures that arise from rework, a real possibility with advent of numerous lead-free alloys.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	MATC(A)83
Keywords:	lead-free solder, MTDATA, enthalpy, rework, alloy mixture
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:17
URI:	http://eprintspublications.npl.co.uk/id/eprint/2412

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