Brewin, A; Hunt, C (2001) Test method for the measurement of tensile and shear tack for electronic solder pastes and adhesives. NPL Report. MATC(A)31

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Abstract

A test method is detailed for measuring the tack force exhibited by electronic solder pastes and adhesives. The test method describes the measurement of tack forces normal to, and in the plane of the circuit board surface (tensile and shear tack respectively).

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	MATC(A)31
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:17
URI:	http://eprintspublications.npl.co.uk/id/eprint/2019

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