Dusek, M; Hunt, C (2002) Assessment of rheological properties of materials used in printing of solder paste. NPL Report. MATC(A)76

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Abstract

The printing process is the most critical step in surface mount assembly, with over half of production defects being attributed to it. To control a printing process the correct process parameters must be set and monitored to ensure quality, and to correct any deterioration. Fully automated printing machines can, to some extent, correct process parameters, but the wide range of degradation modes makes a complete control system difficult. Rheological properties are the key factor in designing new solder pastes. This project will focus on rheological properties that are vital for print grade solder paste materials. By optimising the rheological properties to widen the process window, demands on the machine setting are reduced.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	MATC(A)76
Keywords:	solder paste, rheology
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:17
URI:	http://eprintspublications.npl.co.uk/id/eprint/2331

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