Dusek, M; Hunt, C (2004) Measurement note - crack detection methods for lead-free solder joints. NPL Report. DEPC-MN 001

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Item Type:	Report/Guide (NPL Report)
NPL Report No.:	DEPC-MN 001
Keywords:	shear, microsection
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:16
URI:	http://eprintspublications.npl.co.uk/id/eprint/2974

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