Dusek, M; Wickham, M; Hunt, C (2003) The impact of thermal cycle regime on the shear strength of lead-free solder joints. NPL Report. MATC(A)156

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Abstract

The purpose of this work was to undertake a comparison of accelerated test regimes for lead-free solders. Identical samples were subjected to six different regimes to investigate the effect of thermal excursions, ramp rates and temperature dwells. The most damage to joints was found to be caused by thermal cycling between -55 and 125 o C, with a 10 o C/min ramp rate and 5 minute dwells. Larger thermal excursions were shown to give faster results without compromising failure mode.
Similar degrees of damage to lead-free solder joints were experienced with thermal shock regimes with ramp rates in excess of 50 o C/min. However, these regimes, although faster to undertake, appeared to cause different crack propagation modes than the thermal cycling. However, the difference may be small and thermal shock testing may still be used to differentiate between or enable ranking of, process or material changes.
The results across all types of cycles showed very little difference in rates of joint degradation between SAC (95.5Sn3.8Ag0.7Cu) and SnAg (96.5Sn3.5Ag) solder alloys.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	MATC(A)156
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:16
URI:	http://eprintspublications.npl.co.uk/id/eprint/2921

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