Wickman, M; Brewin, A; Zou, L; Hunt, C (2003) Code of practice for the electronic components and PCBs in lead-free processing. NPL Report. MATC(A)141

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Abstract

With the widening interest in, and need to implement, lead-free soldering processes, there has been much discussion and speculation on the stability and survivability of electronic devices and PCBs at lead-free soldering temperatures. This Code of Practice covers some of the issues associated with the use of these components under the more stringent requirements of a lead-free process.
Generally, there are only minor issues associated with the higher temperature processing, with the majority of components remaining within specification. There are, however, concerns with capacitors, laminates with low glass transition temperatures, and components and multilayer PCBs that are susceptible to moisture ingression. Some misalignment issues with ultra fine pitch QFPs after lead-free soldering are also highlighted.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	MATC(A)141
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:16
URI:	http://eprintspublications.npl.co.uk/id/eprint/2751

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