Zou, L; Dusek, M; Wickham, M; Hunt, C (2001) The effect of solder alloy, metal particle size and substrate resist on fine pitch stencil printing performance. NPL Report. MATC(A)18

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Abstract

The drive to use ever finer pitch printing of solder pastes has raised a number of questions regarding the quality of the printed paste. This study was undertaken to investigate the effects of a number of factors (solder composition, metal particle size and resist thickness) on the quality of fine pitch stencil printing, and the results are encouraging for the users of fine pitch printing and lead-free solders. First, if the total metal content is adjusted to compensate for the changes in density, the traditional high quality printing can be maintained when using lead-free solder paste. Second, the size of the metal particles in the pastes does not have a significant effect on the quality of the printed paste, which improves as the particle size is reduced. However, there is a balance to be achieved with the increased incidence of solder balling when using pastes having the finer particles. Third, the robustness of the printing process restricts and adverse effects of the thickness of the solder resist, resulting in only minor deterioration in print quality when using resists thicker than 30 mm.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	MATC(A)18
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:17
URI:	http://eprintspublications.npl.co.uk/id/eprint/2110

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