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The analytical model for thermal cycling.

Dusek, M; Hunt, C (2004) The analytical model for thermal cycling. NPL Report. MATC(A)163

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The reliability of electronics assemblies is highly dependent on quality of solder joints. To assess a solder joint quality and its life-time several techniques were evaluated [1] showing that destructive techniques still represent major source of reliable data. Shear testing is used to measure thermal cycling induced damage in a form of internal cracks inside a solder joint. Main issue is to find a universal descriptive formula summarising effect of thermocycling parameters on a degradation variable. In this report the degradation variable is represented by ultimate shear strength of a solder joint.

Item Type: Report/Guide (NPL Report)
NPL Report No.: MATC(A)163
Subjects: Advanced Materials
Advanced Materials > Electronics Interconnection
Last Modified: 02 Feb 2018 13:16
URI: http://eprintspublications.npl.co.uk/id/eprint/3268

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