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A novel measurement technique for stencil printed solder paste.

Dusek, M; Hunt, C (2001) A novel measurement technique for stencil printed solder paste. NPL Report. MATC(A)08

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The printing process is the most critical step in surface mount assembly, with the highest fraction of defects attributed to it. To control and monitor printing, complex instrumentation is available for measuring the print consistency. Data from such techniques are essential in product development, SPC and quality control.
This report describes a novel robust method, which introduces critical variables defining print quality. Conventional measurement methods include only the volume and average height of solder paste. The limitations of using just these parameters are discussed and a new method is introduced. The latter processes height data from a scanned in two main steps. The first, matrix leveling, takes account of non-flat surfaces or related samples. The second is the calculation of PVO (pseudo-virtual object) parameters, deposited volume, PVO angle (related to slumping and bridging) and mean height. Major attributes of the proposed data analysis algorithm is its insensitivity to both the specific location of the printed deposit and the location of a specific defect. This algorithm coupled with variables defined in the analysis package delivers a new and flexible approach to printed media. Examples of modelling matrices are presented in the Appendix.

Item Type: Report/Guide (NPL Report)
NPL Report No.: MATC(A)08
Keywords: solder, paste, measurement, laser scanning
Subjects: Advanced Materials
Advanced Materials > Electronics Interconnection
Last Modified: 02 Feb 2018 13:17
URI: http://eprintspublications.npl.co.uk/id/eprint/2308

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