Hunt, C; White, D; Dusek, M; Wickham, M (1998) Impact on assembly yields when substituting palladium finished for Tin/Lead finished components. NPL Report. CMMT(A)130

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Abstract

There is concern within certain parts of the industry on using palladium finished components. Palladium finished components have lower solderability which potentially will have an adverse effect on process yield. This study compares process defect levels between similar SOIC14 components with palladium and tin/lead finishes, using several assembly processes. Some of these assembly processes achieved a zero defect level with tin/lead finished components, and also achieved a zero defect level with palladium finished components. However, the process operating window is much narrower and many manufacturers will not be able to make the transition quickly and simply to a zero defect process with palladium finished components. Indeed 33% of the manufacturers in this study did not achieve this transition. This work has identified some of the reasons for the narrower process window and highlights some of the pitfalls of introducing palladium finished components.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	CMMT(A)130
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	10 Sep 2018 12:58
URI:	http://eprintspublications.npl.co.uk/id/eprint/1029

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