Dusek,M,, ; Hunt, C (1999) Optimum pad design and solder joint shape for reliability. NPL Report. CMMT(A)215

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Item Type:	Report/Guide (NPL Report)
NPL Report No.:	CMMT(A)215
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:18
URI:	http://eprintspublications.npl.co.uk/id/eprint/1147

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