Wickham, M; Hunt, C (1999) Benchmarking assisted and automatic optical inspection of electronic assemblies. NPL Report. CMMT(A)173

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Abstract

Automatic optical inspection of a number of reflow soldered printed circuit assemblies with known defects was undertaken. Six automatic systems and one comparator based system were evaluated. All the equipment benchmarked exhibited acceptable capabilities in locating missing components, misalignment of passive components (0603 size), tantalum capacitors, SOICs and coarser pitch QFPs, bridging of SOICs, component polarities and wrong value tantalum capacitors.
Some systems performed better than others at locating misalignment of PLCCs and finer pitch QFPs, insufficient solder joints on PLCCs, tantalum capacitors, QFP toe fillets, SOIC toe fillets, 0603 passive components and SOIC heel fillets, excessive solder joints, bridges on PLCCs and QFPs and wrong PLCCs, QFPs, 0603 passives and SOICs.
No equipment was 100% successful at locating insufficient solder joints on QFP heel fillets or through-hole hole joints.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	CMMT(A)173
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:18
URI:	http://eprintspublications.npl.co.uk/id/eprint/1093

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