Brewin, A; Zou, L; Hunt, C (2001) Tack testing of solder paste in tension and shear. NPL Report. MATC(A)29

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Abstract

An industry relevant technique for a full understanding of the tack properties exhibited by solder pastes is presented. Uniquely the tack of the paste in the direction normal to the printed circuit assembly (PCA) surface, and parallel to it, has been studied proving an easy method of differentiating and classifying materials. The method has been shown to be sensitive enough to monitor ageing of pastes and the effects of test probe geometry, the insertion and withdrawal speed of the probe, and insertion force have all been studied in the work.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	MATC(A)29
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:17
URI:	http://eprintspublications.npl.co.uk/id/eprint/2021

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