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Tack of electronic adhesives in tension and shear.

Brewin, A; Zou, L; Hunt, C (2001) Tack of electronic adhesives in tension and shear. NPL Report. MATC(A)30

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An industry relevant test technique for a full understanding of the tack properties exhibited by conductive and non-conductive electronic adhesives is presented. Uniquely the tack of the adhesives in the direction normal to the printed circuit assembly (PCA) surface, and parallel to it, has been studied proving an easy method of differentiating and classifying materials. The effects of test probe geometry, insertion and withdrawal speed of the probe, and insertion force have all been studies in the work.

Item Type: Report/Guide (NPL Report)
NPL Report No.: MATC(A)30
Subjects: Advanced Materials
Advanced Materials > Electronics Interconnection
Last Modified: 02 Feb 2018 13:17
URI: http://eprintspublications.npl.co.uk/id/eprint/2020

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