Wickham, M; Zou, L; Dusek, M; Hunt, C (2002) A review of electronics materials deposition techniques including solder jetting and relief printing. NPL Report. MATC(A)92

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Abstract

This report presents a review of two deposition techniques, solder jetting and relief printing, being considered to complement the traditional stencil printing or needle dispensing. The review of solder jetting highlighted a number of potential niche applications for technique. The majority of these are low volume applications which could avail themselves of the direct write capability of the technology, such as application of solder to substrates for selective deposition for DCA applications or via fill. Wafer bumping in low volume for specialist devices such as ASICs, as well as chip scale package bumping. could also benefit from the direct write capabilities of the process.
Relief printing (printing through thick plastic stencils with underside recesses) of adhesives has been successfully demonstrated with the manufacture of simultaneous double-sided reflow (SDRF) soldered assemblies, but some limits to the technology have emerged. To utilise this process, end users may find that solder paste and adhesives deposition will have to be limited to the larger components or coarser pitch components where large stencil apertures can be used. Adhesive printing proved easier than solder paste printing. However, the technique should be eminently suitable for printing of larger area deposits, such as for coarser pitch components, thermal adhesive under perimeter arrays (QFPs), or die-bond adhesives for chip on board assemblies. In these applications, relief printing may prove faster than needle dispensing.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	MATC(A)92
Keywords:	solder jetting, relief printing, intrusive reflow, double sided reflow
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:17
URI:	http://eprintspublications.npl.co.uk/id/eprint/2395

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