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The effect of temperature on microstructure of lead-free solder joints.

Le Toux, T; Dusek, M; Hunt, C (2003) The effect of temperature on microstructure of lead-free solder joints. NPL Report. MATC(A)157

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Abstract

Samples of surface mounted components cooled during their solidification process were subjected to aging treatment in accelerated way to develop microstructural changes. Microsections of solder joints were analysed and methods for measurement of characteristic size of Sn-dendrite is proposed. These tools can be used to detect structures (such as dendrites, dendrites grains, or intermetallic features).
The impact of cooling rate and iso-thermal ageing on the microstructure of lead-free alloys as used in surface mount joints is investigated. The changes in the tin dendrites and intermetallics are measured using image analysis tools developed here. The algorithm developed produces a numerated classification that can be correlated with the aging of the microstructure.

Item Type: Report/Guide (NPL Report)
NPL Report No.: MATC(A)157
Subjects: Advanced Materials
Advanced Materials > Electronics Interconnection
Last Modified: 02 Feb 2018 13:16
URI: http://eprintspublications.npl.co.uk/id/eprint/3267

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