Dusek, M; Hunt, C (2005) Creep rates and stress relaxation for micro-sized lead-free solder joints. NPL Report. DEPC-MN 021

Text DEPC_MN21.pdf Download (497kB)

Abstract

No abstract available

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	DEPC-MN 021
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:16
URI:	http://eprintspublications.npl.co.uk/id/eprint/3253

Actions (login required)

View Item