Brewin, A; Zou, L; Hunt, C (2002) Development of new solderability test fluxes. NPL Report. MATC(A)122

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Abstract

The wetting balance test is a well-established method of measuring the solderability of component leads and board finishes. It measures the forces as solder wets the sample under test. Currently a test flux based on a high percentage of rosin with a halide activator is specified in IEC68000 series for use on the sample and solder globule. This flux technology does not represent the wide spread usage of flux formulations based on weak organic acids, which are now used commonly in co-clean and water based fluxes. Hence there is a need to provide new standard test flux formulations that represent these new flux formulations.
This report describes the development and validation of two new organic acid based solderability test fluxes. Wetting balance trials were performed on a range of trial formulations with SnPb, Pd and Sn component finishes. SnPb and SnAgCu solder alloys were used. New test flux formulations are proposed which provide good differentiation for aged components, are lead-free compatible, represent alcohol and water based systems, and detect compatibility issues relevant for modern flux users.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	MATC(A)122
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:17
URI:	http://eprintspublications.npl.co.uk/id/eprint/2480

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