Zou, L; Lea, D; Hunt, C (2004) Solderability testing of surface mount components and PCB pads. Measurement Good Practice Guide. 66

Text (Measurement Good Practice Guide No. 66) mgpg66.pdf - Published Version Download (353kB)

Abstract

This document guides you to choose the correct test parameter settings for solderability testing of different type and size surface mount components and PCB pads. Pass/fail criteria are suggested and examples of good and bad solderability curves for each type component and PCB pad are given in the document to help you to judge the solderability of test component.

Item Type:	Report/Guide (Measurement Good Practice Guide)
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:16
URI:	http://eprintspublications.npl.co.uk/id/eprint/2952

Actions (login required)

View Item