Kamara, E*; Lu, H*; Hunt, C; Di Maio, D; Thomas, O (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectron. Reliability, 50 (9-11). pp. 1706-1710.

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Abstract

Vibration loading can have a significant effect impact on the reliabilityof electronic components. Due to cyclic strain and stress in the materials making up the component these can cause damage and hence wear out failures. The recent move to lead-free soldering.

Item Type:	Article
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:15
URI:	http://eprintspublications.npl.co.uk/id/eprint/4773

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