Dusek, M; Hunt, C (2002) A test procedure for measurement of solder volume effect on reliability. NPL Report. MATC(A)128

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Abstract

The acquisition of solder materials data is essential to predict and model solder joint reliability for surface mount electronic assemblies. However, such testing is time-consuming and expensive, therefore alternatives to the traditional methods of solder joint fatigue assessment are assessed. An additional driver is the progression of the industry to use components that require smaller and finer solder joints. Traditional acquisition of materials data has used the typical dumb bell shape sample. Here we propose a methodology that uses realistic volumes of solder that reflect today’s microelectronics industry. Furthermore, this test procedure is based on a stress relaxation method as opposed to a creep measurement method. The procedure proposed here outlines a new sample configuration and loading regime. The illustrating results indicate that the solder joint volume has a major impact on stress relaxation during strain dwells.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	MATC(A)128
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:17
URI:	http://eprintspublications.npl.co.uk/id/eprint/2483

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