Wickham, M; Salter, M; Ridler, N M; Dusek, M; Hunt, C (2008) On-wafer testing of PCB lines as a production assessment method for anisotropic conductive film bonding. NPL Report. MAT 18

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Abstract

To assess its suitability for production assessment of anisotropic conductive film (ACF) joints between flexible and rigid substrates, time domain reflectometery (TDR) characterisation, using a vector network analyser (VNA), of a range of differently bonded test samples has been undertaken. Based on the analysis of the reflected signal from various points on the sample, the aim was to interpret some factor that corresponded to the quality of the ACF joint.
The high frequency electromagnetic TDR technique was able to successfully detect the bonding section joining the PCB lines including the beginning and ending of the bonded section along the length of the PCB lines. However, the technique was not able to detect any significant changes in the performance of the bonds due to ageing, nor was it able to detect the effect of graduated bonding pressure on the performance of the bonds.
Some suggestions have been made for future investigations that could be undertaken to improve the sensitivity of this test system and test method so that changes due to ageing and/or bond pressure may become discernible.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	MAT 18
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:15
URI:	http://eprintspublications.npl.co.uk/id/eprint/4179

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