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Items where Author is "Dusek, M"

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Number of items: 54.

Di Maio, D; Thomas, O; Dusek, M; Hunt, C P (2011) Novel testing instrument for lead-free solder characterisation. IEEE Trans. Instrum. Meas., 60 (10). pp. 3444-3450.

Wickham, M; Salter, M; Ridler, N M; Dusek, M; Hunt, C (2008) On-wafer testing of PCB lines as a production assessment method for anisotropic conductive film bonding. NPL Report. MAT 18

Dusek, M; Hunt, C (2008) Fatigue damage prediction during thermo-mechanical cycling for lead-free solders. In: ESTC 2008: 2nd Electronics System-integration Technology Conference Proceedings, 2008.

Wickham, M; Dusek, M; Hunt, C (2007) Reliability of electronic substrates after processing at lead-free soldering temperatures. NPL Report. MAT 10

Dusek, M; Hunt, C P (2007) Low cycle isothermal fatigue properties of lead-free solders. NPL Report. DEPC-MPR 058

Wickham, M; Zou, L; Dusek, M; Hunt, C P (2006) Measuring the impact of land size and solder joint volume on lead-free solder joint reliability. NPL Report. DEPC-MPR 044

Dusek, M; Hunt, C P (2006) Statistical analysis of the effect of PCB finish and processing solder joint on integrity. NPL Report. DEPC-MPR 047

Dusek, M; Hunt, C P (2006) Test approach to isothermal fatigue measurements for lead-free solders. NPL Report. DEPC-MPR 048

Wickham, M; Zou, L; Dusek, M; Hunt, C (2005) Measuring the impact of component solderability on lead-free solder joint reliability. NPL Report. DEPC-MPR 038

Dusek, M; Hunt, C (2005) The analytical model II for predicting solder joint shape and volume impact on life-time. NPL Report. DEPC-MPR 039

Dusek, M; Wickham, M; Hunt, C (2005) Effect of PCB finish, processing and microstructure on lead-free solder joint reliability. NPL Report. DEPC-MPR 028

Wickham, M; Zou, L; Dusek, M; Hunt, C (2005) Measuring the reliability of electronics assemblies during the transition period to lead-free soldering. NPL Report. DEPC-MPR 030

Brewin, A; Zou, L; Dusek, M; Hunt, C (2005) Preliminary measurements of soldering flux residues in AC environment. NPL Report. DEPC-MPR 029

Dusek, M; Hunt, C (2005) Creep rates and stress relaxation for micro-sized lead-free solder joints. NPL Report. DEPC-MN 021

Wickham, M; Dusek, M; Zou, L; Hunt, C (2005) Effect of voiding on lead-free reliability. NPL Report. DEPC-MPR 033

Dusek, M; Hunt, C (2005) The measurement of creep rates and stress relaxation for micro sized lead-free solder joints. NPL Report. DEPC-MPR 021

Ridout, S*; Dusek, M; Bailey, C*; Hunt, C (2005) Modeling and experiments on an isothermal fatigue test for solder joints. In: Thermal Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 18-20 April 2005, Berlin, Germany.

Dusek, M; Hunt, C (2004) Measurement note - crack detection methods for lead-free solder joints. NPL Report. DEPC-MN 001

Dusek, M; Hunt, C (2004) Crack detection methods for lead-free solder joints. NPL Report. MATC(A)164

Dusek, M; Wickham, M; Hunt, C (2004) Shear strength of lead-free solder joints. NPL Report. MATC(MN)57

Dusek, M; Hunt, C (2004) The analytical model for thermal cycling. NPL Report. MATC(A)163

Le Toux, T; Dusek, M; Hunt, C (2003) The effect of temperature on microstructure of lead-free solder joints. NPL Report. MATC(A)157

Dusek, M; Wickham, M; Hunt, C (2003) The impact of thermal cycle regime on the shear strength of lead-free solder joints. NPL Report. MATC(A)156

Wickham, M; Zou, L; Dusek, M; Hunt, C P (2003) Influence of stencil and aperture design on fine pitch printing for various solder paste types. NPL Report. MATC(A)145

Wickham, M; Zou, L; Dusek, M; Hunt, C (2002) Design guidelines for ultra fine pitch solder paste printing. NPL Report. MATC(A)127

Dusek, M; Hunt, C (2002) A test procedure for measurement of solder volume effect on reliability. NPL Report. MATC(A)128

Dusek, M; Hunt, C (2002) A test procedure for measuring print quality. NPL Report. MATC(A)129

Zou, L; Dusek, M; Wickham, M; Hunt, C (2002) Characterising stencil printing of surface mount and conductive adhesives. NPL Report. MATC(A)55

Dusek, M; Zou, L; Hunt, C (2002) Rheology testing of solder pastes and conductive adhesives - a guide. NPL Report. MATC(A)109

Brewin, A; Hunt, C; Dusek, M; Nottay, J (2002) Reliability of joints formed with mixed alloy solders. NPL Report. MATC(A)85

Dusek, M; Zou, L; Hunt, C (2002) Rheology testing of solder pastes and conductive adhesives used in stencil printing. NPL Report. MATC(A)102

Dusek, M; Hunt, C (2002) Test methods for evaluating the reliability of PCB finishes using lead-free alloys - a guide. NPL Report. MATC(A)107

Wickham, M; Zou, L; Dusek, M; Hunt, C (2002) A review of electronics materials deposition techniques including solder jetting and relief printing. NPL Report. MATC(A)92

Dusek, M; Hunt, C (2002) Assessment of rheological properties of materials used in printing of solder paste. NPL Report. MATC(A)76

Zou, L; Dusek, M; Wickham, M; Hunt, C (2001) The effect of solder alloy, metal particle size and substrate resist on fine pitch stencil printing performance. NPL Report. MATC(A)18

Nottay, J; Dusek, M; Wickham, M; Hunt, C (2001) Reworking solder alloy mixtures of lead-free and tin-lead alloys. NPL Report. MATC(A)73

Dusek, M; Nottay, J; Hunt, C; Lu, H*; Bailey, C* (2001) An experimental validation of modelling for Pb-free solder joint reliability. NPL Report. MATC(A)11

Dusek, M; Hunt, C (2001) A novel measurement technique for stencil printed solder paste. NPL Report. MATC(A)08

Lea, D; Dusek, M; Jonck, F; Hunt, C (2001) Solderability of electrical components and copper using lead-free alloys. NPL Report. CMMT(A)284

Dusek, M; Nottay, J; Hunt, C (2001) Compatibility of lead-free solders with PCB materials. NPL Report. MATC(A)89

Nottay, J; Dusek, M; Hunt, C; Bailey, C*; Lu, H* (2001) Creep properties of SnAgCu solder in surface mount assemblies. NPL Report. MATC(A)51

Zou, L; Dusek, M; Wickham, M; Hunt, C (2001) Fine pitch stencil printing using enclosed printing systems. NPL Report. MATC(A)09

Zou, L; Dusek, M; Wickham, M; Hunt, C (2001) The effect of metal content and flux chemistry on fine pitch stencil printing performance using an enclosed print head. NPL Report. MATC(A)10

Dusek, M; Jonck, R; Subotic, B; Nottay, J; Tomlins, P E (2000) Conductive adhesives versus lead based solders : a comparison of performance. NPL Report. CMMT(A)297

Dusek, M; Hunt, C (2000) Best practice guide for thermocycling and reliability assessment of solder joints. NPL Report. CMMT(A)274

Dusek, M; Nottay, J; Hunt, C (2000) A test methodology for assessing Pb-free solder joint reliability. NPL Report. CMMT(A)273

Dusek, M; Nottay, J; Hunt, C (2000) The use of shear testing and thermal cycling for assessment of solder joint reliability. NPL Report. CMMT(A)268

Wickham, M; Dusek, M; Hunt, C (2000) Fine pitch paste stencil printing using enclosed printing heads. NPL Report. CMMT(A)247

Lu, H*; Bailey, C*; Dusek, M; Hunt, C; Nottay, J (2000) Modelling the fatigue life of solder joints for surface mount resistors. In: International Symposium on Electronic Materials and Packaging, 30 November - 3 December 2000, Hong Kong.

Dusek, M; Hunt, C (1999) The impact of solderability on reliability and yield of surface mount assembly. NPL Report. CMMT(A)214

Wickham, M; Dusek, M; Zou, L; Hunt, C P (1999) Improving the processability of noble metal component termination finishes. NPL Report. CMMT(A)199

Zou, L; Dusek, M; Hunt, C P; Dunn, B D* (1999) An evaluation of the effect of ageing on the cleanability of solder flux residues. Soldering & Surface Mount Technology, 11 (1). pp. 27-35.

Hunt, C; White, D; Dusek, M; Wickham, M (1998) Impact on assembly yields when substituting palladium finished for Tin/Lead finished components. NPL Report. CMMT(A)130

Zou, L; Dusek, M; Hunt, C (1998) Evaluate the effect of ageing on the cleanabilty of solder flux residues. NPL Report. CMMT(A)107

This list was generated on Tue Dec 7 18:36:14 2021 GMT.