Dusek, M; Jonck, R; Subotic, B; Nottay, J; Tomlins, P E (2000) Conductive adhesives versus lead based solders : a comparison of performance. NPL Report. CMMT(A)297

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Abstract

Fully functional electronic devices for managing office lighting systems have been manufactured using both conventional tin/lead solder and an isotropically conducting adhesive. The performance of the two joining media has been assessed through measurements of impact resistance and shear strength determined before and after exposure to an extended programme of thermal cycling (from -20°C to 100°C). Monitoring of the functionality of the device during the period of thermal cycling provides an additional performance indicator.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	CMMT(A)297
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:17
URI:	http://eprintspublications.npl.co.uk/id/eprint/2024

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