Dusek, M; Hunt, C P (2006) Statistical analysis of the effect of PCB finish and processing solder joint on integrity. NPL Report. DEPC-MPR 047

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Abstract

The reliability of electronics assemblies is crucially dependent on the quality of the solder joint. Credible data on the latter can be assessed using destructive shear testing and accelerated ageing techniques, and relating the joint shear strength to the damage induced by the thermal cycling. Previous work had successfully generated such mathematical relationships for the impact on joint reliability of joint shape and volume. That work has been extended in an attempt to generate similar relationships for other factors (PCB pad finish, substrate material, thermal processing variables, and solder alloy) possibly impacting on joint reliability.
The shear strength data were encouraging and indicated that:

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	DEPC-MPR 047
Keywords:	board finish, processing temperature
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:15
URI:	http://eprintspublications.npl.co.uk/id/eprint/3687

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