Wickham, M; Zou, L; Dusek, M; Hunt, C P (2003) Influence of stencil and aperture design on fine pitch printing for various solder paste types. NPL Report. MATC(A)145

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Abstract

This work has explored the limits of printing at fine pitch for three solder pastes having different particle sizes. It has employed stencils manufactured via three different routes (laser cut; laser cut and electropolished; electroformed) and apertures of different geometries (circular; square; rectangular) and different dimensions. Paste release from the stencil walls becomes key with small apertures, and in this work the ratio of the aperture area to side wall area (the ARR) has been found to provide a good guide in predicting print performance. It can be widely applied.
The results highlight that from the point of view of print quality, the combination of thin stencils and type 6 solder paste will yield the best performance, but this needs to be taken in the context of other factors in the assembly process. Stencil characteristics that provide the best performance are electroformed with circular apertures. Practicable limits are suggested for combinations of paste type, aperture width and stencil thickness.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	MATC(A)145
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:16
URI:	http://eprintspublications.npl.co.uk/id/eprint/2753

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