Hunt, C P; Crocker, L E; Thomas, O; Wickham, M; Clayton, K; Zou, L; Ashayer-Soltani, R; Longford, A* (2014) High temperatures solder replacement to meet RoHS. NPL Report. MAT 64

Zou, L; Hunt, C (2013) Guideline for measuring coating adhesion to electronic boards using tape peel testing. Measurement Good Practice Guide. 117

Zou, L; Hunt, C (2012) A new conformal coating adhesion test for electronic assemblies. Solder. Surf. Mount Technol., 24 (1). pp. 12-21.

Hunt, C P; Wickham, M; Thomas, O; Zou, L (2010) Impedance testing for sensitivity to delamination in printed circuit boards. NPL Report. MAT 40

Hunt, C P; Wickham, M; Thomas, O; Zou, L (2010) Assessment of moisture content measurement methods for printed circuit boards. In: Annual IPC International Conference for Electronics Board Design and Manufacture and Assembly., 6-8 April 2010, Las Vegas, USA.

Zou, L; Hunt, C (2009) Characterisation of the conduction mechanisms in adsorbed electrolyte layers on electronic boards using AC impedance. J. Electrochem. Soc., 156 (1). C8-C45

Wickham, M; Zou, L; Hunt, C P (2009) Measuring the effect of substrate and component finishes on the reliability of isotropic electrically conductive adhesive joints. Solder. Surf. Mount Technol., 21 (4). pp. 12-18.

Zou, L; Hunt, C (2008) Electrochemical impedance technique to predict circuit reliability with lead-free solders. NPL Report. MAT 15

Wickham, M; Zou, L; Hunt, C (2008) Test method for recyclable electronic substrates utilising additive technology. NPL Report. MAT 16

Zou, L; Hunt, C (2008) Electrochemical behaviour of metal interconnects in electronic assemblies. J. Mater. Res., 23 (10). pp. 2622-2629.

Wickham, M; Zou, L; Hunt, C (2007) Preliminary measurements for thermoplastic electronics: developing a stress screening test. NPL Report. MAT 6

Zou, L; Hunt, C (2007) Susceptibility of lead-free systems to electrochemical migration. NPL Report. MAT 1

Zou, L; Hunt, C (2007) Test method for conformal coating protection performance of electronic assembly in harsh environments. NPL Report. DEPC-MPR 060

Wickham, M; Zou, L; Hunt, C P (2006) Measuring the reliability of technology demonstrator manufactured with isotropic electrically conductive adhesives. NPL Report. DEPC-MPR 046

Zou, L; Hunt, C (2006) Protection performance of conformal coatings in harsh environments. NPL Report. DEPC-MPR 054

Wickham, M; Zou, L; Hunt, C P (2006) Measuring the effect on isotropic electrically conductive adhesive reliability of joint design characteristics. NPL Report. DEPC-MPR 045

Wickham, M; Zou, L; Dusek, M; Hunt, C P (2006) Measuring the impact of land size and solder joint volume on lead-free solder joint reliability. NPL Report. DEPC-MPR 044

Zou, L; Hunt, C (2005) Solderability testing with components preheating. NPL Report. DEPC-MN 038

Wickham, M; Zou, L; Dusek, M; Hunt, C (2005) Measuring the impact of component solderability on lead-free solder joint reliability. NPL Report. DEPC-MPR 038

Zou, L; Hunt, C (2005) Development of preheat on solderability testing. NPL Report. DEPC-MPR 036

Wickham, M; Zou, L; Hunt, C (2005) Measuring the effect on isotropic electrically conductive adhesive reliability of substrate and component finishes. NPL Report. DEPC-MPR 031

Wickham, M; Zou, L; Dusek, M; Hunt, C (2005) Measuring the reliability of electronics assemblies during the transition period to lead-free soldering. NPL Report. DEPC-MPR 030

Brewin, A; Zou, L; Dusek, M; Hunt, C (2005) Preliminary measurements of soldering flux residues in AC environment. NPL Report. DEPC-MPR 029

Wickham, M; Dusek, M; Zou, L; Hunt, C (2005) Effect of voiding on lead-free reliability. NPL Report. DEPC-MPR 033

Zou, L; Brewin, A; Hunt, C (2004) Guidelines for measuring anionic contamination of Printer Circuit Boards (PCB) and Circuit Assemblies (PCA) using ion chromatography. Measurement Good Practice Guide. 76

Wickham, M; Zou, L; Hunt, C (2004) Developing a stress screening regime for isotropic electrically conductive adhesives. NPL Report. DEPC-MPR 005

Zou, L; Lea, D; Hunt, C (2004) Solderability testing of surface mount components and PCB pads. Measurement Good Practice Guide. 66

Brewin, A; Zou, L; Hunt, C (2004) Susceptibility of glass-reinforced epoxy laminate to conductive anodic filamentation. NPL Report. MATC(A)155

Wickham, M; Zou, L; Dusek, M; Hunt, C P (2003) Influence of stencil and aperture design on fine pitch printing for various solder paste types. NPL Report. MATC(A)145

Wickman, M; Brewin, A; Zou, L; Hunt, C (2003) Code of practice for the electronic components and PCBs in lead-free processing. NPL Report. MATC(A)141

Wickham, M; Zou, L; Dusek, M; Hunt, C (2002) Design guidelines for ultra fine pitch solder paste printing. NPL Report. MATC(A)127

Brewin, A; Zou, L; Hunt, C (2002) Development of new solderability test fluxes. NPL Report. MATC(A)122

Brewin, A; Zou, L; Hunt, C (2002) Test procedure for process validation with surface insulation resistance. NPL Report. MATC(A)121

Zou, L; Dusek, M; Wickham, M; Hunt, C (2002) Characterising stencil printing of surface mount and conductive adhesives. NPL Report. MATC(A)55

Dusek, M; Zou, L; Hunt, C (2002) Rheology testing of solder pastes and conductive adhesives - a guide. NPL Report. MATC(A)109

Dusek, M; Zou, L; Hunt, C (2002) Rheology testing of solder pastes and conductive adhesives used in stencil printing. NPL Report. MATC(A)102

Wickham, M; Zou, L; Hunt, C (2002) An assessment of the suitability of current PCB laminates to withstand lead-free reflow profiles. NPL Report. MATC(A)91

Wickham, M; Zou, L; Dusek, M; Hunt, C (2002) A review of electronics materials deposition techniques including solder jetting and relief printing. NPL Report. MATC(A)92

Brewin, A; Zou, L; Hunt, C (2002) Test method for dispensing electronic process materials. NPL Report. MATC(A)86

Brewin, A; Zou, L; Hunt, C (2001) Code of practice for dispensing electronic materials. NPL Report. MATC(A)82

Brewin, A; Zou, L; Hunt, C (2001) Stability of electronic components in lead-free processing. NPL Report. MATC(A)79

Zou, L; Dusek, M; Wickham, M; Hunt, C (2001) The effect of solder alloy, metal particle size and substrate resist on fine pitch stencil printing performance. NPL Report. MATC(A)18

Zou, L; Dusek, M; Wickham, M; Hunt, C (2001) Fine pitch stencil printing using enclosed printing systems. NPL Report. MATC(A)09

Zou, L; Dusek, M; Wickham, M; Hunt, C (2001) The effect of metal content and flux chemistry on fine pitch stencil printing performance using an enclosed print head. NPL Report. MATC(A)10

Brewin, A; Zou, L; Hunt, C (2001) Tack of electronic adhesives in tension and shear. NPL Report. MATC(A)30

Brewin, A; Zou, L; Hunt, C (2001) Tack testing of solder paste in tension and shear. NPL Report. MATC(A)29

Zou, L; Hunt, C (2000) Validation of a new surface insulation resistance (SIR) test method. NPL Report. CMMT(A)300

Tomlins, P E; Zou, L (2000) The surface insulation resistance performance of glob tops exposed to different temperature/humidity combinations. NPL Report. CMMT(A)292

Tomlins, P E; Zou, L (2000) A method to quantify the surface insulation resistance performance of glob tops exposed to different temperature/humidity combinations. NPL Report. CMMT(A)290

Tomlins, P E; Nottay, J; Zou, L (2000) The influence of thermal cycling on the adhesion of conformal coatings. NPL Report. CMMT(A)277

Tomlins, P E; Zou, L (2000) Surface insulation resistance and the properties of conformal coatings. NPL Report. CMMT(A)267

Hunt, C; Zou, L (1999) Development of a new surface insulation resistance (SIR) test method. NPL Report. CMMT(A)235

Zou, L; Hunt, C (1999) The effect of test voltage, test pattern and board finish on surface insulation resistance (SIR) measurements for various fluxes. NPL Report. CMMT(A)222

Wickham, M; Dusek, M; Zou, L; Hunt, C P (1999) Improving the processability of noble metal component termination finishes. NPL Report. CMMT(A)199

Zou, L; Hunt, C (1999) Draft NPL SIR measurement procedure. NPL Report. CMMT(A)155

Zou, L; Dusek, M; Hunt, C P; Dunn, B D* (1999) An evaluation of the effect of ageing on the cleanability of solder flux residues. Soldering & Surface Mount Technology, 11 (1). pp. 27-35.

Hunt, C; Zou, L (1999) The impact of temperature and humidity conditions on surface insulation resistance (SIR) values for various fluxes. Journal of Soldering and Surface Mount Technology, 11 (1). pp. 36-43.

Hunt, C; Zou, L (1998) Instructions for an intercomparison of the surface insulation resistance (SIR) technique. NPL Report. CMMT(A)122

Zou, L; Hunt, C (1998) Surface insulation resistance (SIR) response to various processing parameters. NPL Report. CMMT(A)120

Hunt, C; Zou, L (1998) The impact of temperature and humidity conditions on surface insulation resistance (SIR) values for various fluxes. NPL Report. CMMT(A)119

Zou, L; Dusek, M; Hunt, C (1998) Evaluate the effect of ageing on the cleanabilty of solder flux residues. NPL Report. CMMT(A)107