Wickham, M; Zou, L; Hunt, C P (2009) Measuring the effect of substrate and component finishes on the reliability of isotropic electrically conductive adhesive joints. Solder. Surf. Mount Technol., 21 (4). pp. 12-18.

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Abstract

As the transition away from lead-containing solders gathers momentum, isotropic conducting adhesives (ICAs) are being considered as possible replacements for conventional SnPb solder in a range of applications. Consequently, the reliability of ICA joints is under scrutiny and in previous work by the authors, a suitable test regime was identified to generate relevant reliability data. In the present work, those tests have been employed to investigate whether the finishes on the components and/or PCBs have any effect on the reliability of the ICA joints after exposure to damp heat conditions.

The effect of different finishes was found to be very adhesive material dependent. Two adhesives were studied, and for one material the joint reliability was relatively unaffected by changes in component or PCB surface finish. However, for the second material, and components with a high tin content plated finish, the joints displayed a less stable resistance.

The surface finish on the PCB was found to have a smaller effect on joint reliability than the component finish, with results dependent on adhesive material type. Performance with one material exhibited little difference in reliability irrespective of the PCB surface finish. For the second material, the joint reliability performance with components having the ENIG (electroless nickel/immersion gold) finish, was not as good as that with components having the immersion tin or silver finishes.

Item Type:	Article
Keywords:	Isotropic conductive adhesive, Reliability, Component finishes
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:15
URI:	http://eprintspublications.npl.co.uk/id/eprint/4570

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