Livina, V N; Lewis, A P; Wickham, M (2020) Tipping Point Analysis of Electrical Resistance Data with Early Warning Signals of Failure for Predictive Maintenance. Journal of Electronic Testing, 36. pp. 569-576. ISSN 0923-8174

Lewis, A P; Hunt, C; Thomas, O; Wickham, M (2017) High-Speed Non-Contact Sheet Resistivity Monitoring of Printed Electronics using Inductive Sensors. Flexible and Printed Electronics, 2 (4). 044001

Samano, A*; Xu, Y*; Harrison, D*; Hunt, C; Wickham, M; Thomas, O (2016) Impedance and resistance of carbon ink during cure. Circuit World, 42 (3). pp. 117-126.

Hunt, C P; Wickham, M; Pittson, R*; Lewison, J* (2015) Reusable, unzippable, sustainable electronics (ReUse) interconnect system for the circular economy. NPL Report. MAT 75

Samano, A*; Xu, Y*; Harrison, D*; Hunt, C; Wickham, M; Thomas, O (2014) Third harmonic measurement in printed electronics. In: 3rd Asia-Pacific Conference on Antennas and Propagation., 26-29 July 2014, Harbin, China.

Hunt, C P; Crocker, L E; Thomas, O; Wickham, M; Clayton, K; Zou, L; Ashayer-Soltani, R; Longford, A* (2014) High temperatures solder replacement to meet RoHS. NPL Report. MAT 64

Thomas, O J; Hunt, C P; Wickham, M (2012) Finite difference modelling of moisture diffusion in printed circuit boards with ground planes. Microelectron. Reliability, 52 (1). pp. 253-261.

Thomas, O; Wickham, M; Hunt, C (2012) Obtaining the moisture content of printed circuit boards from capacitance measurements. Circuit World, 38 (2). pp. 68-74.

Hunt, C P; Wickham, M; Thomas, O; Zou, L (2010) Impedance testing for sensitivity to delamination in printed circuit boards. NPL Report. MAT 40

Wickham, M; Hunt, C; Birch, B*; Furlong, J* (2010) Reliability of electronic substrates after processing at lead-free soldering temperatures; Part 2. NPL Report. MAT 38

Hunt, C P; Wickham, M; Thomas, O; Zou, L (2010) Assessment of moisture content measurement methods for printed circuit boards. In: Annual IPC International Conference for Electronics Board Design and Manufacture and Assembly., 6-8 April 2010, Las Vegas, USA.

Hunt, C P; Wickham, M (2009) Evaluation of the ability of conformal coatings to inhibit tin whiskering. NPL Report. MAT 36

Wickham, M; Jennett, N M; Nunn, J; Gohil, D D; Hunt, C (2009) Measuring tin whiskering propensity:measuring internal stress in tin coatings by nanoindentation. NPL Report. MAT 29

Wickham, M; Zou, L; Hunt, C P (2009) Measuring the effect of substrate and component finishes on the reliability of isotropic electrically conductive adhesive joints. Solder. Surf. Mount Technol., 21 (4). pp. 12-18.

Wickham, M; Hunt, C (2008) Test method for measurement of the propensity for conformal coatings to inhibit tin whiskering. NPL Report. MAT 28

Wickham, M; Salter, M; Ridler, N M; Dusek, M; Hunt, C (2008) On-wafer testing of PCB lines as a production assessment method for anisotropic conductive film bonding. NPL Report. MAT 18

Wickham, M; Zou, L; Hunt, C (2008) Test method for recyclable electronic substrates utilising additive technology. NPL Report. MAT 16

Wickham, M; Dusek, M; Hunt, C (2007) Reliability of electronic substrates after processing at lead-free soldering temperatures. NPL Report. MAT 10

Wickham, M; Zou, L; Hunt, C (2007) Preliminary measurements for thermoplastic electronics: developing a stress screening test. NPL Report. MAT 6

Wickham, M; Hunt, C (2007) XRF measurement of residual materials in electronics. NPL Report. MAT 4

Wickham, M; Hunt, C (2007) Relative reliability measurements for electrically conductive adhesive joints on subtractive thermoplastic substrates. NPL Report. MN 2

Wickham, M; Zou, L; Hunt, C P (2006) Measuring the reliability of technology demonstrator manufactured with isotropic electrically conductive adhesives. NPL Report. DEPC-MPR 046

Wickham, M; Zou, L; Hunt, C P (2006) Measuring the effect on isotropic electrically conductive adhesive reliability of joint design characteristics. NPL Report. DEPC-MPR 045

Wickham, M; Zou, L; Dusek, M; Hunt, C P (2006) Measuring the impact of land size and solder joint volume on lead-free solder joint reliability. NPL Report. DEPC-MPR 044

Wickham, M; Zou, L; Dusek, M; Hunt, C (2005) Measuring the impact of component solderability on lead-free solder joint reliability. NPL Report. DEPC-MPR 038

Dusek, M; Wickham, M; Hunt, C (2005) Effect of PCB finish, processing and microstructure on lead-free solder joint reliability. NPL Report. DEPC-MPR 028

Wickham, M; Zou, L; Hunt, C (2005) Measuring the effect on isotropic electrically conductive adhesive reliability of substrate and component finishes. NPL Report. DEPC-MPR 031

Wickham, M; Zou, L; Dusek, M; Hunt, C (2005) Measuring the reliability of electronics assemblies during the transition period to lead-free soldering. NPL Report. DEPC-MPR 030

Wickham, M; Dusek, M; Zou, L; Hunt, C (2005) Effect of voiding on lead-free reliability. NPL Report. DEPC-MPR 033

Wickham, M; Zou, L; Hunt, C (2004) Developing a stress screening regime for isotropic electrically conductive adhesives. NPL Report. DEPC-MPR 005

Dusek, M; Wickham, M; Hunt, C (2004) Shear strength of lead-free solder joints. NPL Report. MATC(MN)57

Dusek, M; Wickham, M; Hunt, C (2003) The impact of thermal cycle regime on the shear strength of lead-free solder joints. NPL Report. MATC(A)156

Wickham, M; Fry, A T; Hunt, C (2003) Developing a test to characterise internal stress in tin coatings: phase 1. NPL Report. MATC(A)148

Wickham, M; Zou, L; Dusek, M; Hunt, C P (2003) Influence of stencil and aperture design on fine pitch printing for various solder paste types. NPL Report. MATC(A)145

Wickham, M; Zou, L; Dusek, M; Hunt, C (2002) Design guidelines for ultra fine pitch solder paste printing. NPL Report. MATC(A)127

Wickham, M; Hunt, C (2002) A comparison of automatic optical inspection systems for use with lead-free surface mount assemblies. NPL Report. MATC(A)119

Zou, L; Dusek, M; Wickham, M; Hunt, C (2002) Characterising stencil printing of surface mount and conductive adhesives. NPL Report. MATC(A)55

Wickham, M; Brewin, A; Hunt, C (2002) Rework of mixed lead-free alloys - a guide. NPL Report. MATC(A)106

Wickham, M; Zou, L; Hunt, C (2002) An assessment of the suitability of current PCB laminates to withstand lead-free reflow profiles. NPL Report. MATC(A)91

Wickham, M; Zou, L; Dusek, M; Hunt, C (2002) A review of electronics materials deposition techniques including solder jetting and relief printing. NPL Report. MATC(A)92

Zou, L; Dusek, M; Wickham, M; Hunt, C (2001) The effect of solder alloy, metal particle size and substrate resist on fine pitch stencil printing performance. NPL Report. MATC(A)18

Nottay, J; Dusek, M; Wickham, M; Hunt, C (2001) Reworking solder alloy mixtures of lead-free and tin-lead alloys. NPL Report. MATC(A)73

Wickham, M; Nottay, J; Hunt, C (2001) A review of mechanical test method standards for lead-free solders. NPL Report. MATC(A)69

Zou, L; Dusek, M; Wickham, M; Hunt, C (2001) Fine pitch stencil printing using enclosed printing systems. NPL Report. MATC(A)09

Wickham, M; Lea, D; Nottay, J; Hunt, C (2001) Processability of lead-free component termination materials. NPL Report. MATC(A)47

Zou, L; Dusek, M; Wickham, M; Hunt, C (2001) The effect of metal content and flux chemistry on fine pitch stencil printing performance using an enclosed print head. NPL Report. MATC(A)10

Wickham, M; Dusek, M; Hunt, C (2000) Fine pitch paste stencil printing using enclosed printing heads. NPL Report. CMMT(A)247

Wickham, M; Dusek, M; Zou, L; Hunt, C P (1999) Improving the processability of noble metal component termination finishes. NPL Report. CMMT(A)199

Wickham, M; Hunt, C (1999) A comparison of automatic optical inspection and automatic x-ray inspection of surface mount assemblies. NPL Report. CMMT(A) 234

Wickham, M; Hunt, C (1999) Benchmarking assisted and automatic optical inspection of electronic assemblies. NPL Report. CMMT(A)173

Hunt, C P; Wickham, M (1999) Stencil printing codes of practice. NPL Report. CMMT(A)165

Hunt, C; White, D; Dusek, M; Wickham, M (1998) Impact on assembly yields when substituting palladium finished for Tin/Lead finished components. NPL Report. CMMT(A)130