Report/Guide

Brewin, A; Willis, B (2007) Characterising solder mask performace. NPL Report. MAT 5

Brewin, A; Zou, L; Dusek, M; Hunt, C (2005) Preliminary measurements of soldering flux residues in AC environment. NPL Report. DEPC-MPR 029

Zou, L; Brewin, A; Hunt, C (2004) Guidelines for measuring anionic contamination of Printer Circuit Boards (PCB) and Circuit Assemblies (PCA) using ion chromatography. Measurement Good Practice Guide. 76

Brewin, A; Zou, L; Hunt, C (2004) Susceptibility of glass-reinforced epoxy laminate to conductive anodic filamentation. NPL Report. MATC(A)155

Wickman, M; Brewin, A; Zou, L; Hunt, C (2003) Code of practice for the electronic components and PCBs in lead-free processing. NPL Report. MATC(A)141

Brewin, A; Zou, L; Hunt, C (2002) Development of new solderability test fluxes. NPL Report. MATC(A)122

Brewin, A; Zou, L; Hunt, C (2002) Test procedure for process validation with surface insulation resistance. NPL Report. MATC(A)121

Hunt, C; Nottay, J; Brewin, A; Dinsdale, A T (2002) Predicting microstructure of mixed solder alloy systems. NPL Report. MATC(A)83

Brewin, A; Hunt, C; Dusek, M; Nottay, J (2002) Reliability of joints formed with mixed alloy solders. NPL Report. MATC(A)85

Wickham, M; Brewin, A; Hunt, C (2002) Rework of mixed lead-free alloys - a guide. NPL Report. MATC(A)106

Brewin, A; Zou, L; Hunt, C (2002) Test method for dispensing electronic process materials. NPL Report. MATC(A)86

Brewin, A; Zou, L; Hunt, C (2001) Code of practice for dispensing electronic materials. NPL Report. MATC(A)82

Brewin, A; Zou, L; Hunt, C (2001) Stability of electronic components in lead-free processing. NPL Report. MATC(A)79

Brewin, A; Hunt, C (2001) Test method for the measurement of tensile and shear tack for electronic solder pastes and adhesives. NPL Report. MATC(A)31

Brewin, A; Zou, L; Hunt, C (2001) Tack of electronic adhesives in tension and shear. NPL Report. MATC(A)30

Brewin, A; Zou, L; Hunt, C (2001) Tack testing of solder paste in tension and shear. NPL Report. MATC(A)29