Report/Guide

Dawson, A; Rides, M; Nottay, J (2006) The effect of pressure on the thermal conductivity of polymer melts. NPL Report. DEPC-MPR 041

Hunt, C; Nottay, J; Brewin, A; Dinsdale, A T (2002) Predicting microstructure of mixed solder alloy systems. NPL Report. MATC(A)83

Brewin, A; Hunt, C; Dusek, M; Nottay, J (2002) Reliability of joints formed with mixed alloy solders. NPL Report. MATC(A)85

Nottay, J; Dusek, M; Wickham, M; Hunt, C (2001) Reworking solder alloy mixtures of lead-free and tin-lead alloys. NPL Report. MATC(A)73

Dusek, M; Nottay, J; Hunt, C; Lu, H*; Bailey, C* (2001) An experimental validation of modelling for Pb-free solder joint reliability. NPL Report. MATC(A)11

Wickham, M; Nottay, J; Hunt, C (2001) A review of mechanical test method standards for lead-free solders. NPL Report. MATC(A)69

Dusek, M; Nottay, J; Hunt, C (2001) Compatibility of lead-free solders with PCB materials. NPL Report. MATC(A)89

Nottay, J; Dusek, M; Hunt, C; Bailey, C*; Lu, H* (2001) Creep properties of SnAgCu solder in surface mount assemblies. NPL Report. MATC(A)51

Wickham, M; Lea, D; Nottay, J; Hunt, C (2001) Processability of lead-free component termination materials. NPL Report. MATC(A)47

Tomlins, P E; Nottay, J (2001) A method to measure the adhesive strength of glob tops to substrates. NPL Report. MATC(A)6

Nottay, J; Tomlins, P E; Subotic, B (2000) Thermal cycling and the adhesion of glob tops. NPL Report. CMMT(A)287

Dusek, M; Jonck, R; Subotic, B; Nottay, J; Tomlins, P E (2000) Conductive adhesives versus lead based solders : a comparison of performance. NPL Report. CMMT(A)297

Tomlins, P E; Nottay, J; Zou, L (2000) The influence of thermal cycling on the adhesion of conformal coatings. NPL Report. CMMT(A)277

Dusek, M; Nottay, J; Hunt, C (2000) A test methodology for assessing Pb-free solder joint reliability. NPL Report. CMMT(A)273

Dusek, M; Nottay, J; Hunt, C (2000) The use of shear testing and thermal cycling for assessment of solder joint reliability. NPL Report. CMMT(A)268

Conference or Workshop Item

Lu, H*; Bailey, C*; Dusek, M; Hunt, C; Nottay, J (2000) Modelling the fatigue life of solder joints for surface mount resistors. In: International Symposium on Electronic Materials and Packaging, 30 November - 3 December 2000, Hong Kong.